5 Minute Epoxy Gels, 50 mL, Dev-Pak, Amber
Features: Thixotropic, nonmigrating gel adhesive with excellent gap filling properties | High tensile strength | Good solvent resistance | Non-sagging adhesive | Fills gaps to .25 inch | Fast curing for bond tags on machinery and equipment
Testing And Approvals: Chemical resistance was tested by immersion for 30 days at 75 °F, after 7 days room temperature cure; Cured hardness tested according to ASTM D-2240; Cured density tested according to ASTM D1002; Compression strength tested according to ASTM D695; D
Standard Pack: 12 TB / CA
Country Of Origin: US
