HP 250 Epoxy, 50 mL, Dev-Pak, Straw

Features: High-performance, gap-filling thixotropic paste for structural bonding applications | Superior toughness, impact and chemical resistant | Bonds metals, FRP/SMC composites, phenolics, stainless steel, aluminum, vinyl esters, nylon, PVC, PC, styrenics, wood, and rigid plastics | Excellent gap fill.